ตำแหน่ง Full-time Investor in Stock Exchange of Thiailand

บริษัท -

ที่อยู่บริษัท -

เงินเดือน สำหรับสมาชิกเท่านั้น

ลักษณะงานที่ทำ
Day-trade investment in many financial products e.g. stocks, warrants, derivative warrants which are listed in Stock Exchange of Thailand.

ตำแหน่ง WELL COMPLETION ENGINEER

บริษัท WEATHERFORD KSP THAILAND

ที่อยู่บริษัท 31st FLOOR, INTERCHANGE BUILDING, WATTANA, BANGKOK

เงินเดือน สำหรับสมาชิกเท่านั้น

ลักษณะงานที่ทำ
1. Lead engineer of Offshore & Onshore operations of Well completion tools&Equipment installation including Upper&Lower completion, Zone-selected perforation completion, Sand screen with chemical injection sub.(Ex-Customer e.g. PTTEPI, CHEVRON, KRIS ENERGY, CEPSA, PETRO VIETNAM)
2. Focal point of management and contact among field team, office and client during offshore&onshore operations.
3. Lead project engineer for Well completion tools preparation at workshop (Tools assemble and documents).
4. Well completion tools installation design & calculation.
5. Technical support for Well completion operation tenders.

ตำแหน่ง Sales engineer

บริษัท SGS Mould&Tools

ที่อยู่บริษัท BANGBORN, BANGKOK, THAILAND

เงินเดือน สำหรับสมาชิกเท่านั้น

ลักษณะงานที่ทำ
1. Achieving sales target of Plastic injection mold of Automotive & Electric appliance manufacturing industries (Ex-Customer e.g. Toyota Motor, Sharp
2. Mold maintenance and after sale service.
3. Member of committee for ISO 9001 certification verification project.

ประสบการณ์ทำงานอื่นๆ
Sanyo Semicondutor Thailand (1 พฤศจิกา 2552 - 31 มีนาคม 2555)
Process&Maintainance engineer
Assistant Section Responsible (ASR) of Wafer probing test process (1 Jan 2011 - 31 Mar 2012)
1. Facilitated transfer and installation of production machine from SANYO Semiconductor Corp. Japan.
2. Systematize new manufacturing process transferred from Japan.
3. Machines maintenance program planning and implementation.
4. Involved in quality and productivity improvement projects using Six Sigma techniques and On-semiconductor Management Methodologies.
5. Performed tasks assigned by the head of Probe Testing Engineering section.

Group Group Responsibility (GR) of ECSP Assembly & Molding process (1 Nov 2009 - 31 Dec 2010)
1. Responsible for the planning and the implementation of maintenance program.
2. Involved in quality, productivity improvement and cost reduction projects.
3. Performed tasks assigned by the head of ECSP Assembly & Molding section.

สถาบัน Weatherford Malaysia Corp.

หลักสูตร Weatherford Slick-plug & Packer running and services

สถาบัน Technical Petroleum Training Institute (TPTI)

หลักสูตร Basic Offshore Safety Induction & Emergency Training (BOSIET)

สถาบัน ON Semiconductor Philippines, Muntinglupa, Philippines

หลักสูตร ON Semiconductor methodologies project management